Accelerate Edge Evolution with Advantech High Performance Edge Computing Solutions

Edge computing plays a key role in embedded IoT networks. Rising demands for computing power are pushing these solutions to the next generation. The new edge solutions require powerful computing capabilities, high bandwidth transmission, and information security. Advantech integrates embedded platforms with these featured technologies to help customers build reliable IoT Solutions.

  • MASS DATA PROCESSING
    Streaming data aggregate, analysis and transfer
  • HIGH NETWORK BANDWIDTH
    Reduce Data Transmission Time
  • SCALABILITY & EASY DEPLOYMENT
    Modularized Design for Quick Expandability
  • REMOTE MANAGEMENT
    Easy Accessibility and Operation
  • LOW LATENCY
    Time-Sensitive Communication
  • INDUSTRIAL MOTHERBOARDS

    Micro-ATX
    • AIMB-592
      • AMD EPYC 7003 series
      • Up to 768GB DDR4
      • Four PCIe x16 slots
      • x2 10GbE, x2 2.5GbE
      • IPMI 2.0
    • AIMB-588
      • Intel® 12th Gen Core™ i processor
      • PCIe x16 Gen5 slot
      • x1 GbE LAN, x3 2.5GbE LANs
      • x1 USB 3.2 Gen2 Type C
      • Four displays. (x2 DP, HDMI, eDP)
    • AIMB-522
      • AMD Embedded Ryzen™ 5000 series AM4 processor
      • PCIe x16, PCIe x4, PCIe x4 slots
      • x2 2.5GbE & x2 GbE LANs
      • Three displays. (DP, VGA, HDMI)
    Mini-ITX
    • AIMB-288E
      • Intel® 12th Gen Core™ i processor
      • NVIDIA® Quadro® Embedded T1000 integrated
      • Up to 64GB DDR5 4800MHz
      • Three displays (x2 DP, eDP)
      • M.2 M key & M.2 B key
  • COMPUTER ON MODULE

    COMe Compact
    • ROM-8720
      • NXP LS1046A Arm® Cortex®-A72 Quad Cores Processor
      • 1x DDR4 SODIMM, max. 32GB
      • Up to 2x 10Gbe and 4x GbE
      • PCIe 3.0 x3/2.0 x2, USB 3.0 x3
      • Support Ubuntu BSP
    COM-HPC Client Size C
    • SOM-C350
      • Intel® 12th Gen Core™ i9/i7/i5/i3 desktop socket type processor
      • 4x DDR5 SODIMM, max. 128GB
      • 16x PCIe Gen5, 16x Gen4, 10x Gen3
      • 2x 2.5GbE LAN, 2x USB 3.2 Gen2
      • Light & thin cooler for best effifficiency
    COM-HPC Server Size E
    • SOM-E780
      • COM-HPC® Server Size E with proprietary pinout
      • Up to 64-Cores EYPC™ 7003 CPU
      • Up to 512GB DDR4
      • 79x PCIe Gen4 lanes
      • IPMB for BMC remote control
    COM-HPC Server Size D
    • SOM-D580
      • Intel® Xeon® D-2700 Processor (Ice Lake-D HCC)
      • Up to 20 Cores, 118W TDP
      • DDR4-3200, up to 512GB
      • 4x 25GBASE-KR, IPMB
      • 32 x PCIe Gen 4, 17 x PCIe Gen 3
  • COM-HPC

    • Boost Performance With COM-HPC : Join the Computer-on-Module Evolution
      Advantech Evaluation Kit
      • 16C/110W processor
      • 512GB memory with 8pcs 288pin DIMM
      • 45 lanes PCIe gen3 expansion
      • 4 ports 10GBASE-KR & 1 port 1000BASE-T
      • Pinout: COM-HPC Server type
      • Size E 200 x 160 mm (7.87 x 6.29 in)
    • OverviewAdvantech’s COM-HPC is a evolutionary computer on module with excellent CPU performance. It features Super Speed interfaces, diverse pin definitions, a selection of board sizes, and brand new connectors. COM-HPC is aimed at complementing the full spectrum of COM express modules to meet performance demands for next generation edge computing solutions.

      • Server Pinout : board size D & E. Headless design and 25GBASE-KR with 4~8pcs DIMM
      • Client Pinout : board size A,B & C. Provides graphics and NBASE-T with 2~4pcs SODIMM
  • EDGE COMPUTER

    Server Grade Edge Computing Platform
    • EPC-B5587
      • Intel® 10th Gen XEON CPU W1290E
      • 4 DDR4 UDIMM ECC RAMs
      • Support NVDIA graphic card up to 350W
      • High-speed data transfer via Dual 10GbE ports
      • Up to 6 Shock Resistant 2.5" drive bays
      • RAID 0 / 1 / 5 / 10
    Xeon Edge Computer for AI Vision
    • ARK-7060
      • Intel® Xeon D-1700 processor up to 10 cores
      • 4x DDR4 SO-DIMM memory up to 128GB
      • Support NVIDIA graphic card up to 350W
      • High-speed data transfer via 10GbE & 5G
      • IPMI2.0 remote management & security
  • INDUSTRIAL PERIPHERALS

    SQFlash
    • SQF-C8M ER-1 series
      • PCIe Gen.4 x4, M.2 2280 NVMe SSD, upto 3.2TB
      • Read/Write performance up to 6,500/ 5,000 MB/sec
      • AES-256 & TCG-OPAL support, included LDCP & RAID ECC
      • DWPD 1 and DWPD 3 support
      • Heat-spreading design with thermal solution
    SQRAM
    • SQR-UD5 (ECC)
      • DDR5
      • 288PIN UDIMM
      • Data transfer rate: 4800 MT/s
      • Capacity: 16GB/32GB
      • Operating temperature: 0-95C
      • ECC function supported
    • SQR-SD5N
      • DDR5
      • 262PIN SODIMM
      • Data transfer rate: 4800 MT/s
      • Capacity: 8GB/16GB/32GB
      • Operating temperature: 0-95C
      • SQ Manager software support
    Windows
    • Ubuntu Desktop
      • GUI available
      • Tri-weekly security update
      • LTS: 10 years of long-term support (with 5 years ESM services)
      Windows Server 2022 LTSC
      • Advanced multi-layer security
      • Hybrid capabilities with Azure
      • Flexible application platform
      • Windows Admin Center
  • Quadro Flow Cooling Solution

    Slim, quiet, and powerful design features advanced high-efficiency cooling solution to enable extreme computing performance.

    • 100% CPU
      Power

    • Silent
      Operation

    • Thin &
      Light

    • Easy
      Assembly

  • Advanced Manufacturing Process

    Improving product quality by IPC-A-610G Class 3 certification.

    • Strict layout design & quality check
    • 100% function check and visual inspection
    • Ability of IPC-A-610G class 3 manufacturing
  • Wide Temperature Operation Services
  • Conformal Coating Services

    Moisture, dust, corrosion, and friction resistance

    • Rust and corrosion prevention
    • Electrical insulation
    • Prolong longevity
  • Anti-Vibration Solution & Service

    MIL-STD-810 anti-vibration design, reliability enhancements, and strict verification

    • Key component soldiering, corner bonding capabilities.
    • Adhere to MIL-STD-810 test procedures
    • Optimized mechanical design and custom service

APPLICATIONS

  • Diagnostic Imaging
    • PCI Express x16 slot
    • Intel® Xeon® CPU
    • ESD Level 4
  • 5G Micro Cell Station
    • Up to 16-core CPU
    • Dual 10 Gigabit Ethernet
    • Up to 512 GB memory
  • Surveillanc
    • Four 10GbE LAN
    • AI-enabled Video Analytics
    • Virtual RAID on CPU
  • Outdoor Mobile Server
    • CPU, RAM and storage soldered down
    • 10GBASE-KR
    • T ambient: -40 ~ 85 °C
  • High Speed Test Equipment
    • Max. Intel® Xeon® 16C and 128GB memory
    • PCIe Gen. 4 expansion
    • Small FF & Low profile