Embedded Board and Service for Mission-Critical Applications

DESIGN-IN SERVICE FOR RUGGEDIZED APPLICATION

  • Component Selection & Control
    Certified components & suppliers for environments with wide temperature & humidity
    • 2011/65/EU RoHS
    • 1907/2006 REACH
  • Design Quality
    Strict layout design & process check
    • IPC-4101
    • IPC-A-610G Class 2 & 3
  • Wide Temperature
    Thermal simulation and validation. 100% testing in chamber before shipping
    • IEC60068-2
    • MIL-STD-810G
  • Anti-Shock/Vibration
    External mechanical fixing for key parts; corner bonding for main chip
    • IEC60068-2-64
    • MIL-STD-810G
  • Conformal Coating
    Automatic coating process and visual inspection
    • MIL-I-46058C
  • Manufacturing Capability
    Advanced manufacturing process in electronics assembly industries
    • ISO9001 & ISO14001
    • IPC-A-610G Class 2 & 3
  • COMPUTER ON MODULE

    • COMe Mini - SOM-7583
      • Intel core up to i7 processor
      • Soldered memory & NVMe
      • IPC-A-610G class 3
    • RTX v2.1 - ROM-3620
      • NXP i.MX 8X, Cortex-A35
      • Onboard RAM & eMMC
      • IPC-A-610G class 3
      • -40~85°C
    • COMe Compact - ROM-8720
      • NXP LS1046A, 4x Cortex-A72
      • Onboard eMMC
      • 10 Gbps & USB 3.2
      • -20~70°C
    • COMe Compact - SOM-6883
      • 11th Gen Intel Core Processor
      • Onboard RAM & NVME SSD
      • PCIe Gen 4 & USB 4
      • -40~85°C
  • EMBEDDED SINGLE BOARD

    • Pico-ITX RSB-3730
      • NXP i.mx8 8M Cortex-A53
      • Onboard DDR4, eMMC
      • UIO40-express I/O expansion
      • Lockable DC-jack 12V, -40~85°C
    • Pico-ITX MIO-2363
      • Intel Atom x6000E processor
      • 2x GbE, HDMI, LVDS, 2x M.2
      • Onboard LPDDR4x & eMMC
      • DC-in12-24V, -40~85°C
    • Pico-ITX MIO-2375
      • 11th Gen Intel Core processor
      • 2x GbE, eDP/MIPI-DSI, DP, 2x M.2
      • Onboard LPDDR4x & M.2 NVMe
      • DC-in 12V, -40~85°C
    • 3.5" SBC MIO-5375
      • 11th Gen Intel core processor
      • Dual-CH DDR4 & M.2 Gen.4 NVMe
      • 2x GbE, HDMI/DP/LVDS, USB-C, TPM
      • DC-in 12-24V, -40~85°C
  • INDUSTRIAL-GRADE SYSTEM

    • Fanless In-Vehicle System TS-206
      • 6th Gen Intel core processor
      • 4 ports PoE, 2x COM w/ isolation
      • E-Mark, UL, CCC, BSMI certified
      • DC-IN 12/24V, -20~60°C
    • Fanless IP protected System TS-207
      • 11th Gen Intel core processor
      • Onboard DDR4 & NVMe SSD
      • Powerful native AI & IP65 enclosure
      • DC-IN 12/24V, -40~70°C
  • INDUSTRIAL-GRADE PERIPHERAL

    • SODIMM - SQR-YD4
      • DDR4 2666 with mounting holes
      • MIL-810G military level shock verified
      • -40~85ºC
    • 2.5 SSD - SQF-C25 920
      • U.2 2.5" NVMe SSD up to 7.6TB
      • Advanced thermal solution
      • -40~85ºC
    • Mini PCIe - AIW-343
      • LTE Cat.4 + GNSS reliable connection
      • Available for US/EU/JP/AU
      • -40~85°C
    • M.2 E Key - AIW-165
      • Wi-Fi 6 + BT 5.3 (NXP 88W9098)
      • Long life 7 years longevity
      • -40~85 °C

How does Advantech meet your harsh indoor & outdoor needs?

Advantech ruggedized solutions are the ideal choice for customers looking for flexible I/O and 24/7 reliability. Advantech’s products can operate in a wide temperature ranges and adheres to exacting standards from design to production. Advantech’s selection features solutions for extreme environments and harsh outdoor applications.

  • Hardware Design
    • Component selection
    • Quality thermal design
    • Laboratory tested
    • High vibration tolerance
    • BIOS and TPM secured
  • Embedded Software
    • Remote hardware monitoring and control
    • Vertical I.Apps and WISE-PaaS Marketplace
    • AIM-Linux and Windows
  • Manufacturing Capability
    • Phoenix: 100% temperature screening
    • Phoebus: natively extended temperature with ORT
    • 100% test and inspection
  • Add-on Services
    • Conformal coating
    • Corner bonding
    • Anti-sulfur materials
    • Extended longevity supports
    • MIL-STD 810G/IPC-A 610G Class 3 certifications
  • Quadro Flow Cooling Solution

    Slim, quiet, and powerful design features advanced high-efficiency cooling solution to enable extreme computing performance.

    • 100% CPU
      Power

    • Silent
      Operation

    • Thin &
      Light

    • Easy
      Assembly

  • Advanced Manufacturing Process

    Improving product quality by IPC-A-610G Class 3 certification.

    • Strict layout design & quality check
    • 100% function check and visual inspection
    • Ability of IPC-A-610G class 3 manufacturing
  • Wide Temperature Operation Services
  • Conformal Coating Services

    Moisture, dust, corrosion, and friction resistance

    • Rust and corrosion prevention
    • Electrical insulation
    • Prolong longevity
  • Anti-Vibration Solution & Service

    MIL-STD-810 anti-vibration design, reliability enhancements, and strict verification

    • Key component soldiering, corner bonding capabilities.
    • Adhere to MIL-STD-810 test procedures
    • Optimized mechanical design and custom service

CASE STUDY