Advantech understands your various challenges while developing high computing performance applications in medical, factory automation, and edge computing. Quadro Flow Colling System (QFCS) is designed for optimized thermal design. It ticks several boxes such as high heat dissipation efficiency, low noise margins, and a compact heatsink.
Low Noise Design Reduces User Annoyance
Tool-free design to simplify assembly process
Dual copper heat pipes quickly equalize temperature
Stacked & extrusion fins designed to maximize cooling surface and air exchange
Copper block dissipates heat quickly by making direct contact with CPU
Vertical airflow for expediting memory heat dissipation
9th/8th Gen Intel® Xeon®/ Core™ Processors COM Express Basic Module Type 6
8th/9th Gen Intel® Core™ Processors with Compact Design of the Enclosure
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