Tiny Size,
Limitless Performance
Revolutionizing the AIoT Landscape with the Advantech Computer-on-Module Series Based on the Open Standard Module by SGET
In the ever-evolving embedded market, driven by the growth of AIoT, including edge AI and sensor nodes, the demand for compact, dependable, and rapidly scalable solutions has never been greater. Advantech, in partnership with the Standardization Group for Embedded Technologies (SGET), presents a range of tiny solder-on modules following the Open Standard Module (OSM) standard, complete with pre-defined hardware and software interfaces. These modules complement the existing Computer-On-Modules, and backed by Advantech’s manufacturing and software prowess, our OSM solutions spearhead the era of miniature embedded technology, ensuring future adaptability.
Space Efficiency
Tiny and ultra-thin design for applications where space is limited
Enhanced Reliability
A module assembled with SMT offers better vibration tolerance
Fast Development
OSM integration of HDI PCB, memory, and PMIC expands capabilities while simplifying carrier board design
Features At A Glance
Four compact sizes are available with corresponding LGA configurations
The all-new standard of Open Standard Module is available in 4 versatile sizes: Size Zero, Small, Medium, and Large, ranging from 15x30mm to 45x45mm. These four form factors seamlessly complement one another, allowing for easy scalability and integration. Each size corresponds to the number of LGA contacts on the module, offering flexibility for various application requirements.
Fully automatic SMT assembly with ultra-thin, anti-vibration design and reduced total cost of ownership
The OSM utilizes fully automatic SMT (Surface Mount Technology) assembly, eliminating the need for additional connectors for board-to-board connection. This results in a thinner, more space-efficient profile, which is especially beneficial when dealing with space constraints in electronic device design. It also offers enhanced resilience to vibration, shock, and other mechanical stressors. This is ideal for AIoT devices in demanding industrial settings. Furthermore, it significantly reduces the total cost of ownership with reduced material costs while providing enhanced production efficiency and quality control.
OSM (Assembled with SMT)
SMARC (Assembled with Golden Finger)
Height Considerations of SMT and Golden Finger Assembly
Highly functional flexibility
The OSM assembled with SMT enables higher component density on PCBs, allowing for more features and functionality in a smaller footprint. The pinout configuration includes video interfaces such as RGB, Camera Serial Interface (CSI), DisplayPort, and LVDS, as well as connection interfaces with up to 2 x PCIe x4, 5 x GbE Ethernet, and 2 x USB 3.2.
| OSM Size | 0 | S | M | L |
|---|---|---|---|---|
| LAN | 1 | 2 | 3 | 5 |
| USB 2.0 | 2 | 3 | 4 | 4 |
| USB 3.0 | N/A | 1 | 2 | 2 |
| UART Console | 1 | 1 | 1 | 1 |
| UART | 4 | 4 | 4 | 4 |
| GPIO Contacts | 15 | 23 | 31 | 39 |
| SPI | 2 | 2 | 3 | 3 |
| I2C | 2 | 2 | 2 | 2 |
| I2S / PDM | 1 | 1 | 1 | 1 |
| SDIO | 2 | 2 | 2 | 2 |
| UFS | 1 | 1 | 1 | 1 |
| CAN | 2 | 2 | 2 | 2 |
| Analog Input Contacts | 2 | 2 | 2 | 2 |
| PWM Signals | 6 | 6 | 6 | 6 |
| Parallel Display Interface | N/A | 1 | 1 | 1 |
| MIPI-DSI | 1 | 1 | 1 | 1 |
| Camera-DSI | 1 | 1 | 1 | 1 |
| PCIe x1 | N/A | 1 | 2 | 2 |
| PCIe x4 (support PCIe x1/ PCIe x2) | N/A | N/A | N/A | 2 |
| eDP/eDP++ | N/A | N/A | 2 | 2 |
| LVDS | N/A | N/A | N/A | 1 |
